The problem is that the LARGER SMT components are becoming UNAVAILABLE TOO! Therefore the techniques described previously HAVE to cope with the SMALLER more common components as well.

• Normally the device pads are soldered INDIVIDUALLY. However this is NOT POSSIBLE with these FINE PITCH devices as the pitch between the device's leads are TOO SMALL.

 
• Therefore place the soldering iron BETWEEN 2 ADJACENT leads.

 
• Apply solder and heat as normal. REMEMBER not to keep the heat applied for VERY LONG, particularly as the pads are SO SMALL, the GLUE will MELT holding the pad.

 
• This will almost certainly SHORT CIRCUIT the 2 leads TOGETHER.

 
• The excess solder can be REMOVED using SOLDER BRAID described in the SOLDER LEVELLING Technique mentioned previously.