Surface
mount pads need to be tinned with solder prior to mounting the component.
When this is completed the pads look like this:
However
observe what happens if you place a SMT component on soldered pads like
these:
and
solder one pad...
To
overcome this problem a technique called Solder
Levelling is
used and is described on the Soldering SMTs
page which also demonstrates the techniques of how to place the SMT components.
